Akrometrix平面度测量仪AXP 相关产品 CORES 平面度测量/平整度测试/加热翘曲测量 core9012a/core9031a/core9032a/core9037a/core9038a/core9045a/core9046a/core9050b/core9055a/core9060a/core9070a/core9100a Akrometrix平面度测量/平整度测试/加热翘曲测量 AXP-300x233/Convective-Module-Tower/CRE6 Module/CXP/DFP Module/DIC 2.0 Module/Digital Fringe Projection/Digital Image Correlation/Akrometrix Interface Analysis/Akrometrix Part Tracking/PS200S/PS600S/Real Time Analysis/Akrometrix Shadow Moiré/Akrometrix Studio Platform
Thermal Warpage and Strain Measurement Tool
The TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample’s behior during a user-defined thermal profile.
The combination of shadow moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behior induced by real-world processes and operating environments. Using the TherMoiré AXP, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies.AXP
The TherMoiré AXP is an expandable modular metrology platform:
Powered by Akrometrix Studio Software Up to 400 mm x 400 mm maximum sample size Acquisition of 1.4 million displacement data points in less than 2 seconds Enhanced temperature uniformity, convective heating and cooling with CRE6 Module High resolution measurement of small form factor samples XYZ axis strain and CTE calculation, via DIC Increased lab productivity with advanced, powered cooling Support for reliability testing from -50°C to 150°C+ and reflow simulation to 280°C+, via CM Multiple part testing for increased throughput The TherMoiré AXP can be used for a variety of laboratory and production floor applications:
Failure/defect analysis Quality assurance/quality cool High Volume Testing complimented by Part Tracking technology Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software Shape matching between attaching interfaces via Interface Analysis Software Material and Design Choices Characterization of Local Features and Step Height using DFP FEA Model Validation The TherMoiré AXP Optional Modules provide advanced measurement, processing and throughput capability: